a copyright ? 2010, everlight americas inc. release date : 05.13.2014. issue no:dir-000xxx w ww.everlightamericas.com 3mm infrared led EAILP03RDAA6 features ? high reliability ? 2.54mm lead spacing ? low forward voltage ? good spectral matching to si photodetector ? high radiant intensity ? pb free ?the product itself will remain within rohs compliant version. description everlight americas infrared emitting (EAILP03RDAA6) is a high intensity diode, molded in a blue transparent plastic package. the device is spectrally matched with phototra nsistor, photodiode and infrared receive module. applications ?infrared applied system
datasheet 3mm infrared led EAILP03RDAA6 2 copyright ? 2010, everlight americas inc. release date : 05.13.2014. issue no:dir-000xxx w ww.everlightamericas.com notes: *1:i fp conditions--pulse width Q 100 s and duty Q 1%. *2:soldering time Q 5 seconds. device selection guide led part no. chip material lens color EAILP03RDAA6 gaalas blue a bsolute maximum ratings (ta=25 ) parameter symbol rating unit continuous forward current i f 100 ma peak forward current *1 i fp 1.0 a reverse voltage v r 5 v operating temperature t opr -40~ +85 storage temperature t stg -40 ~ +100 soldering temperature *2 t sol 260 power dissipation at(or below) 25 free air temperature p d 150 mw
datasheet 3mm infrared led EAILP03RDAA6 3 copyright ? 2010, everlight americas inc. release date : 05.13.2014. issue no:dir-000xxx w ww.everlightamericas.com electro-optical ch aracteristics (ta=25 ) parameter symbol min. typ. max. unit condition radiant intensity ie 4.0 5.6 - mw/sr i f =20ma peak wavelength p - 940 - nm i f =20ma spectral bandwidth ? - 45 - nm i f =20ma forward voltage v f - 1.2 1.5 v i f =20ma reverse current i r - - 10 a v r =5v view angle 2 1/2 - 35 - degree i f =20ma
datasheet 3mm infrared led EAILP03RDAA6 4 copyright ? 2010, everlight americas inc. release date : 05.13.2014. issue no:dir-000xxx w ww.everlightamericas.com 0 -40 -20 40 20 0 60 100 80 20 40 60 100 80 120 140 fig.1 forward current vs. ambient temperature fig.2 spectral distribution forward current (ma) relative radiant intensity (%) ambient temperature( ) wavelength (nm) fig.3 radiant intensity vs. forward current fig.4 re lative radiant intensity vs. angular displacement ie-radiant intensity (mw/sr) relative radiant intensity 700 750 800 850 900 950 1000 1050 0.0 0.2 0.4 0.6 0.8 1.0 relative radinat intensity (%) wavelength (nm) 0.00 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.10 0 10 20 30 40 50 60 70 80 90 100 ie-radiant intensity(mw/sr) if-forward current (a) -20 0.6 0.9 0.7 0.8 1.0 0.2 0.4 0 0.2 0.4 0.6 50 70 80 60 40 30 -10 020 10
datasheet 3mm infrared led EAILP03RDAA6 5 copyright ? 2010, everlight americas inc. release date : 05.13.2014. issue no:dir-000xxx w ww.everlightamericas.com package dimension notes: 1. all dimensions are in millimeters 2. tolerances unless dimensions 0.25mm
datasheet 3mm infrared led EAILP03RDAA6 6 copyright ? 2010, everlight americas inc. release date : 05.13.2014. issue no:dir-000xxx w ww.everlightamericas.com label form specification cpn: customer?s product number ? p/n: ? product number qty: packing quantity ? cat: luminous intensity rank ? hue: dom. wavelength rank ? ref: forward voltage rank ? lot no: lot number ? reference: identify label number ? packing specification anti-electrostatic bag inner carton outside carton packing quantity 1. 1000 pcs/1 bag, 4 bags/1 inner carton 2. 10 inner cartons/1 outside carton
datasheet 3mm infrared led EAILP03RDAA6 7 copyright ? 2010, everlight americas inc. release date : 05.13.2014. issue no:dir-000xxx w ww.everlightamericas.com notes 1. lead forming ? during lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. ? lead forming should be done before soldering. ? avoid stressing the led package during leads forming. the st ress to the base may damage the led?s characteristics or it may break the leds. ? cut the led lead frames at room temperat ure. cutting the lead frames at high tem peratures may cause failure of the leds. ? when mounting the leds onto a pc b, the pcb holes must be aligned exactly with the lead position of t he led. if the leds are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the leds. 2. storage ? the leds should be stored at 30c or less and 70%rh or less after being shipped from everlig ht americas and the storage life limits are 3 months. if the leds are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. ? please avoid rapid transitions in ambien t temperature, especially, in high hum idity environments where condensation can occur. 3. soldering ? careful attention should be paid during soldering. when solder ing, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended. ? recommended soldering conditions: hand soldering dip soldering temp. at tip of iron 300 max. (30w max.) preheat temp. 100 max. (60 sec max.) soldering time 3 sec max. bath temp. & time 260 max., 5 sec max distance 3mm min.(from solder joint to epoxy bulb) distance 3mm min. (from solder joint to epoxy bulb) ? recommended soldering profile
datasheet 3mm infrared led EAILP03RDAA6 8 copyright ? 2010, everlight americas inc. release date : 05.13.2014. issue no:dir-000xxx w ww.everlightamericas.com ? avoiding applying any stress to the lead frame while the le ds are at high temperature particularly when soldering. ? dip and hand soldering should not be done more than one time ? after soldering the leds, the epoxy bulb should be protected fr om mechanical shock or vibration until the leds return to room temperature. ? a rapid-rate process is not recommended for cool ing the leds down from the peak temperature. although the recommended soldering conditi ons are specified in the above table, dip or hand soldering at the lowest possible temperature is desirable for the leds. ? wave soldering parameter must be set and maintain accordin g to recommended temperature and dwell time in the solder wave. 4. cleaning ? when necessary, cleaning should occur only with isopropyl al cohol at room temperature fo r a duration of no more than one minute. dry at room te mperature before use. ? do not clean the leds by the ultrasonic. when it is absolutel y necessary, the influence of ultrasonic cleaning on the leds depends on factors such as ultrasonic power and the assembl ed condition. ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the led 5. heat management ? heat management of leds must be ta ken into consideration during the design stage of led application. the current should be de-rated appropriately by referring to the de-rating curve found in each product specification. ? the temperature surrounding the led in the application should be controlled. please refer to the data sheet de-rating curve. 6. esd (electrostatic discharge) ? electrostatic discharge (esd) or surge current (eos) can damage leds. ? an esd wrist strap, esd shoe strap or antistati c gloves must be worn whenever handling leds. ? all devices, equipment and machinery must be properly grounded. ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic lens as a result of friction between leds during storage and handing. 7. other ? above specification may be changed wi thout notice. everlight americas will re serve authority on material change for above specification. ? when using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. ev erlight americas assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instru ctions included in these specification sheets. ? these specification sheets include materi als protected under copyright of everlight americas corporation. please don?t reproduce or cause anyone to reproduce them without t everlight americas?s consent.
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